WiMAX chip maker, Sequans Communications, has announced its newest its newest chip at the Mobile World Congress.
It’s the SQN1210, which Sequans says integrates baseband and triple band RF in a single 65 nm die for the first time, leading to unprecedented achievements in size, cost and performance.
It’s based on what the company calls state-of-the-art 65 nm technology and four years of Sequans’ proven field experience.
Also today, Sequans announced that ZyXEL, a world supplier of broadband internet connectivity products, is using the SQN1210 to build Mobile WiMAX end user devices. The first device ZyXEL is bringing to market is a tiny USB device that will provide mobile laptop users with WiMAX connectivity.
